To maximise pre-placement yield, it is imperative to perform regular, effective stencil cleaning. As high-density applications and ultra fine pitch assemblies become the norm, cleaning performance beyond conventional paper-based cleaning materials is required.
Pro-Pack offers an under Stencil cleaning roll solution to meet the stringent requirements of today’s electronics manufacturers.
We used lint free wipes that is low lint levels, an ability to clean a variety of apertures, rapid dispense, effective wicking and ongoing productivity.
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